 ## Thermal Analysis of Graphics Card – AEDT Icepak

### Objective:

To study various factors affecting thermal performance of heat sink. According to the design objective, the graphics card temperature should not exceed 80°C, when air sweeps the fins at an ambient temperature of 20°C.

### Modelling:

Graphics card consists of PCB, CPU, Heat sink, Two Capacitors, Two Memory and Serial port. ### Methodology

Following methodology is followed during this thermal analysis,

1) Studied various factors to be considered while designing the Heat sink.

2) Factors which affects the performance Heat transfer of Heat sink.

3) Thermal analysis of graphics card using AEDT Icepak software..

### Principle of Operations:

The principle of operation is to provide larger area over which convective heat transfer can occur than original surface area. (That is use of Heat sink).

### 1) Studied various factors to be considered while designing the Heat sink.

• Power that needs to be dissipated.
• Maximum allowable component temperature.
• Available space/volume for heat sink.
• Power density.
• Air Flow parameters.
• Pressure Drop.
• Manufacturability.
• Cost.

### 2) Factors which affects the performance Heat transfer of Heat sink.

• Arrangement of heat sink/pin fin array.
• Shape of pin fin (cross-section of fin).
• Geometric parameters (diameter, length, aspect ratio, void fraction).
• Pitch between adjacent fins (transverse & longitudinal).
• Number of fins.
• Material of pin fin.
• Shroud clearance (bypass factor).
• Nature of fluid flow (natural or forced).
• Location of fan/Blower in case of forced convection i.e. velocity of flowing fluid.
• Type of flowing fluid.
• Surface finish of the fins.
• Inclination of fins.

### ANSYS AEDT Icepak workflow:

• Problem Type: Thermal and Flow.
• Zero Equation Turbulence model.
• Energy Equation: ON.
• ### Boundary Conditions:

• Inlet Air Opening Velocity: 2 m/s
• Outlet Grille Free Area Ratio: 0.8
• CPU Power generation: 25w
• Memory Power generation: 5w.

### CFD Domain: Note: Size of CFD domain is selected such that atmospheric condition should not change.

### Temperature Plot: Maximum Temperature of the graphics card is 76.13°C.

### Temperature and Velocity Vectors Plot: To achieve maximum cooling effect then maximum amount of air should passed through Heat sink.

### Ending Remarks:

1. Maximum temperature of graphics card is 76.13°C, which is below of designing temperature 80°C.
2. Design and type of Heat sink is important.
3. For better cooling effect maximum amount of air should passed through heat sink.