Solutions for Electromagnetic, Signal Integrity, Thermal and Electro – Mechanical Simulations.
Simulations for antenna, RF, microwave, PCB, package, IC design or even an electromechanical device. These solutions would help to solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in the designs.
Complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
PI and SI analysis: These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.
Electromagnetic interference and capability: Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
Wireless and RF: By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation, engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.
Thermal management: Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution
Electric machine analysis: Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).
Electronics reliability simulation: Manage material information, optimize CAD geometries, perform complex Multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design.