Multiphysics analysis is critical for enabling these cutting-edge electronics systems to work reliably throughout their lifetime. KAIZENAT empowers customers with multiphysics simulations to simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon and system success. KAIZENAT simulation and modeling tools offer you early power budgeting analysis for high-impact design decisions and foundry-certified accuracy needed for IC signoff.
At the core of every electronics system is a chip that must meet multiple conflicting requirements, such as high performance, increased functionality, power efficiency, reliability and low cost. Ensuring the chip meets power efficiency, power integrity and reliability requirements as both a stand-alone component and within the electronics system calls for a system-aware chip design methodology. KAIZENAT uniquely offers a suite of multiscale, multiphysics solutions to support a chip-package-system (CPS) design flow.
The ANSYS semiconductor portfolio of power efficiency, power integrity and reliability solutions achieves ISO 26262 “Tool Confidence Level 1” (TCL1) certification. This certification enables automotive IC designers to meet rigorous safety requirements for ADAS and autonomous applications. Auto chip makers can leverage ANSYS PowerArtist, ANSYS Totem and ANSYS RedHawk family of multiphysics simulations for all ISO 26262 safety-related development projects at any Automotive Safety Integrity Level.
With the cost of designing and implementing a system-on-chip (SoC) ranging from $50 million to $200 million, first-time working silicon is a must. IC designers require the most accurate simulation solution and consider foundry certification as the ultimate proof of accuracy. ANSYS semiconductor solutions have been certified by all leading foundries since 2006.
Our software has enabled thousands of successful tape-outs across multiple technology nodes.